NJL5901R-1 - 1 ? 4-mar-05 1.6 (0.29) (0.42) 0.45 0.2 0.07 0.6 0.07 (0.42) 1.3 0.1 0.1 0.15 0.15 (0.42) 0.15 0.45 0.4 0.4 0.07 0.07 0.1 0.1 0.1 0.2 0.1 led center ptx center cobp photo reflector general description NJL5901R-1 is the compact surface mount type photo reflector, which miniaturized outside dimension compared with the current cobp reflector, njl5901r. compared with the njl5901r, the mounting area of NJL5901R-1 is reduced to 54%. moreover, the output current is 400 a typ. and is raised 180% compared with the njl5901r. features outline (typ.) unit : mm ? miniature, thin package : 1.3mm 1.6mm 0.6mm ? high output : 400 a typ. ? pb free solder re-flowing permitted : 260 c, 2times ? built-in visible light cut-off filter applications ? detecting the location of lens unit for cellular phone?s camera module ? detecting the location of cd/dvd optical pickup head ? detecting the rotation of various motors ? paper edge detection and mechanism timing detection of facsimile, copy machine etc absolute maximum ratings (ta=25 c) parameter symbol ratings unit emitter forward current (continuous) reverse voltage (continuous) power dissipation i f v r p d 30 6 45 ma v mw detector collector-emitter voltage emitter-collector voltage collector current collector power dissipation v ceo v eco i c p c 16 6 10 25 v v ma mw coupled total power dissipation operating temperature storage temperature reflow soldering temperature p tot t opr t stg t sol 60 -20 to +85 -40 to +85 260 mw c c c electro-optical characteristics (ta=25 c) parameter symbol test condition min typ max unit emitter forward voltage reverse current capacitance v f i r c t i f =4ma v r =6v v r =0v,f=1mhz ? ? ? ? ? 25 1.3 10 ? v a pf detector dark current collector-emitter voltage i ceo v ceo v ce =10v i c =100 a ? 16 ? ? 0.2 ? a v coupled output current operating dark current *1 rise time fall time i o i ceod t r t f i f =4ma,v ce =2v,d=0.7mm i f =4ma,v ce =2v i o =100 a,v ce =2v,rl=1k ? ,d=0.7mm i o =100 a,v ce =2v,rl=1k ? ,d=0.7mm 280 ? ? ? ? ? 30 30 700 5 ? ? a a s s *1 icoed may increase according to the peripher y situation of the surface mounted product. 0.65 0.35 0.65 0.36 0.4 0.4 a:anode k:cathode c:collector e:emitter pcb pattern k e c a
NJL5901R-1 - 2 ? 4-mar-05 aluminum evaporation surface light sealed dark box if io vce if vce iceod 0.7mm i f r d p.g input output tr tf 10% 90% aluminum evapolation surface io v+ r l osc aluminum evaporation surface aluminum evaporation surface 0.7mm 0.7mm l=0mm l=0mm direction x direction y output current test condition dark current test condition the infrared signal from led is re flected at the aluminum surface response time test condition edge response test condition
NJL5901R-1 - 3 ? 4-mar-05 power dissipation vs. temperature 0 10 20 30 40 50 60 70 80 90 100 020406080100 ambient temperature ta( c) power dissipation p(mw) forward current vs. temperature 0 5 10 15 20 25 30 35 40 45 50 0 20406080100 ambient temperature ta(c) forward current if(ma) forward voltage vs. forward current 1 10 100 012 forward voltage vf(v) forward current if(ma) forward voltage vs. temperature 0.8 1 1.2 1.4 1.6 -40-20 0 20406080100 ambient temperature ta( c) forward voltage vf(v) dark current vs. temperature 0.001 0.01 0.1 1 10 100 1000 10000 -40-20 0 20406080100 ambient temperature ta(c) dark current iceo(na) operating dark current vs. temperature 0.01 0.1 1 10 -40-20 0 20406080100 ambient temperature ta(c) operating dark current iceod( a) typical characteristics to t a l p o w e r dissipation collector power dissipation if=30ma if=4ma vce=10v if=4ma , vce=2v
NJL5901R-1 - 4 ? 4-mar-05 output current vs. forward current (ta=25 c) 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 0246810 forward current if(ma) output current io( a) output current vs. temperature 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 ambient temperature ta( c) relative output current io/io(25 c)(%) output characteristics (ta=25c) 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 012345 collector-emitter voltage vce(v) output current io( a) vce saturation (ta=25c) 0 0.1 0.2 0.3 0.4 0.5 0.1 1 10 forward current if(ma) collector-emitter voltage vce(v) output current vs. distance (ta=25c) 0 20 40 60 80 100 120 012345 reflector distance d(mm) relative output current io/io(max.)(%) output current vs. edge distance (ta=25c) 0 20 40 60 80 100 120 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 edge distance l(mm) relative output current io/io(max.)(%) if=4ma , vce=2v vce=2v , d=0.7mm if=4ma if=2ma if=6ma if=8ma if=10ma io=100 a io=300 a io=400 a io=500 a if=4ma , vce=2v if=4ma , vce=2v , d=0.7mm direction x direction y
NJL5901R-1 - 5 ? 4-mar-05 spectral response (ta=25 c) 0 20 40 60 80 100 120 500 600 700 800 900 1000 wavelength (nm) relative response (%) switching time vs. load resistance (ta=25 c) 1 10 100 1000 0.1 1 10 load resistance rl(k ? ) switching time t( s) vce=2v vce=2v , io=100 a tr tf td
NJL5901R-1 - 6 ? 4-mar-05 precaution for handling 1. soldering to actual circuit board soldering condition the surface temperature of plastic package is lower than 260 c. soldering method 1) reflow method soldering to be done within twice under the recommended condition mentioned below 2) reflow method (in case of infrared heating) the temperature profile is same as the above avoid direct irradiation to the pl astic package because it ma y absorb the infrared radiation and its surface temperature will be higher than the lead. 3) the other method avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (vps). solder the device in short time as soon as possible. if the device is heated and kept in high temperature for longer time, its reliability would be affected. 2. cleaning avoid washing the device after soldering by reflow method. 3. attention in handling 1) treat not to touch the lens surface. 2) avoid dust and any other foreign materials on the lens surface such as paint, bonding material, etc. 4. storage mount the device as soon as possible after opening the envelope. in order to prevent from degradation by the moisture at the reflow process, the device is contained in deaeration packaging. a b c g e 150 c 260 c room te m p . f 180 c 230 c 220 c d a : temperature ramping rate : 1 to 4 c/s b : pre-heating temperature time : 150 to 180 c : 60 to 120s c : temperature ramping rate : 1 to 4 c /s d : 220 c or higher time : shorter than 60s e : 230 c or higher time : shorter than 40s f : peak temperature : lower than 260 c g : temperature ramping rate : 1 to 6 c /s the temperature of the surface of mold package
NJL5901R-1 - 7 ? 4-mar-05 8.5 13 60 180 label 0.25 0.85 cover tape carrier tape 4.0 2.0 1.45 4.0 3.5 8.0 1.75 1.8 1.5 NJL5901R-1 taping specification (te1) 1. taping size 1) carrier tape is used with styrene type carbonated plastic. 2) cover tape is used with electro statistically prevention treated polyester type tape. 3) product taping direction is to place the index mark against the pull out direction of the tape as in the drawing. pull out direction of tape unit : mm 2. taping strength pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15 , and the peeling-off strength is to be within the power of 20 to 70g. 3. packaging 1) the taped products are to be rolled up on the taping reel as on the drawing. 2) rolling up specification 2-1) start rolling : carrier tape open space more than 20 pieces. 2-2) end of rolling : carrier tape open space more than 20 pieces, and 2 round of reel space at the cover tape only. 3) taping quantity : 2,000 pieces. 4) seal off after putting each reels in a damp proof bag with silica gel (3 bags). [caution] the specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. the application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights.
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